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- Intel® 8th-Gen Core ™ i hexa-core 35W / 65W LGA1151 CPU
- Low-profile chassis with hot-swappable 2.5 "HDD / SSD tray
- MezIO ™ interface for easy function expansion
- Rugged, -25 ° C to 70 ° C fanless operation
- Up to 6x GigE ports, supporting 9.5 KB jumbo frame
- M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane ™ memory
- 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
- VGA / DVI / DP triple independent display, supporting 4K2K resolution
Introducing Neousys Technology's 2018 flagship rugged fanless embedded computers, the new Nuvo-7000LP series, powered by Intel® 8th-Gen Core ™ processors with up to 6-core / 12-thread architecture offering significant performance improvement over previous 6th or 7th -Gen platforms.
Nuvo-7000LP series is a derivative of Nuvo-7000 series which features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, proprietary MezIO ™ interface and plethora of on-board I / O interfaces, Nuvo-7000LP series features one front-accessible, hot-swappable HDD / SSD tray which can be configured as 0 / 1 RAID when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB / s disk read / write speed, or installing an Intel® Optane ™ memory for the ultimate system acceleration.
Neousys Nuvo-7000LP series consolidates the latest Intel hexa-core CPU, high-speed I / O interfaces, super-fast disk access and flexible storage configuration to form a ruggedized high-performance embedded computer. In addition, you can also take advantage of the built-in MezIO ™ interface to add modules for application-specific I / Os.
8th-Gen Core i CPU
Powered by Intel® Coffee lake Core ™ processor running with advanced Intel® Q370 chipset, The Nuvo-7000 series fanless embedded computer provides outstanding performance for emerging high-end requirement than 6th & 7th generations.
The Nuvo-7000 series fanless embedded computer has patented passive cooling thermal design that can effectively channel heat from heat sink and operate in a wide range from -25 to 70 ℃ while under 100% CPU loading.
|Processor||Supporting Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W / 65W TDP)
- Intel® Core ™ i7-8700 / i7-8700T
- Intel® Core ™ i5-8500 / i5-8500T
- Intel® Core ™ i3-8100 / i3-8100T
- Intel® Pentium® G5400 / G5400T
- Intel® Celeron® G4900 / G4900T
|chipset||Intel® Q370 Platform Controller Hub|
|Graphics||Integrated Intel® UHD Graphics 630|
|Memory||Up to 32 GB DDR4 2666 / 2400 SDRAM (two SODIMM slots)|
|I HAVE T||Supports AMT 12.0|
|TPM||Supports TPM 2.0|
|I / O interface|
|Ethernet Port||2x Gigabit Ethernet Ports by I219 and I210 (Nuvo-7002LP)
6x Gigabit Ethernet Ports by I219 and 5x I210 (Nuvo-7006LP)
|POE +||Optional IEEE 802.3at PoE + PSE for Port 3 ~ Port 6 100 W total power budget|
|USB||4x USB 3.1 Gen2 (10 Gbps) ports
4x USB 3.1 Gen1 (5 Gbps) ports
|Video Port||1x VGA connector, supporting 1920 x 1200 resolution
1x DVI-D connector, supporting 1920 x 1200 resolution
1x DisplayPort connector, supporting 4096 x 2304 resolution
|Serial Port||2x software-programmable RS-232 / 422 / 485 ports (COM1 / COM2)
2x RS-232 ports (COM3 / COM4)
|Audio||1x 3.5 mm jack for mic-in and speaker-out|
|Internal Expansion Bus|
|Mini PCI-E||1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)|
|M.2||1x M.2 2242 B socket with dual front-accessible SIM sockets|
|Expandable I / O||1x MezIO ™ expansion port for Neousys MezIO ™ modules|
|SATA HDD||1x front-accessible, hot-swappable 2.5 "HDD / SSD tray
1x internal SATA port for 2.5 "HDD / SSD installation, supporting 0 / 1 RAID
|M.2||1x M.2 2280 M Key Socket (PCIe Gen3 / x4) for NVMe SSD or Intel® OptaneTM memory installation|
|mSATA||1x full-size mSATA port (mux with mini-PCIe)|
|DC Input||1x 3-pin pluggable terminal block for 8 ~ 35VDC DC input|
|Remote Ctrl. & Status Output||1x 3-pin pluggable terminal block for remote control and PWR LED output|
|Size||240 mm (W) x 225 mm (D) x 79 mm (H)|
|Mounting||Wall-mounting (standard) or DIN-Rail mounting (optional)|
with 35W CPU
-25 ° C ~ 70 ° C **
with 65W CPU
-25 ° C ~ 70 ° C * / ** (configured as 35W TDP)
-25 ° C ~ 50 ° C * / ** (configured as 65W TDP)
|Storage temperature||-40 ° C ~ 85 ° C|
|Humidity||10% ~ 90%, non-condensing|
|Vibration||Operating, MIL-STD-810G, Method 514.6, Category 4|
|Shock||Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II|
|EMC||CE / FCC Class A, according to EN 55032 & EN 55024|
Intel® 8th-Gen Coffee Lake Core ™ i7 / i5 / i3 fanless embedded computer with 2x GbE ports, MezIO ™ interface and low-profile chassis
Intel® 8th-Gen Coffee Lake Core ™ i7 / i5 / i3 fanless embedded computer with 6x GbE ports, MezIO ™ interface and low-profile chassis
Supported MezIO ™ Modules
Neousys MezIO ™ module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I / Os such as RS-232 / 422 / 485, isolated DIO and ignition power control.
Normal Delivery | 3 to 5 working days
Urgent Delivery | 1-2 business days
* unless out of stock
We work hard to meet the announced delivery deadlines. However, we face a global shortage for some components and manufacturers.
If you have any questions or concerns, please contact us to ensure delivery time.
We will be able to advise on the availability of alternative hardware and provide recommendations on available components for faster shipping options.