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799.00€
Sku: MX1-10FEP-C246
Industrial PCs
MiTAC

> Normal Delivery | 3 to 5 working days

> Urgent Delivery | 1-2 business days

* unless out of stock

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Fanless embedded system with Intel® Coffee Lake Xeon / Core-i processor

MiTAC's MX1-10FEP embedded system is the next generation embedded system with Intel® Coffee Lake C246 workstation chipset which can support Xeon and Core-i LGA1151 socket type processor. The excellent performance, powerful processor, OCP / OVP power protection, and expandable design provide the solution for every complicated task and most types of application.

The MX1-10FEP's 7.8 liter fan-less chassis design and Xpandable module design give it the possibility to implement the complicated tasks and for every workspace and environment. VESA mount holes allow for space-saving and rear-mounting on VESA arms. Flexibilities also mean a rich array of I / O ports (including 2 x RJ45 Ethernet, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, PCIe X16 slot, 3-pin Terminal Block Power Input, and 3 x Expansion doors) to add a variety of peripherals. Storage expandability is supported for 3 x high-density hard drives in 2.5 "HDD bracket design. Two mPCIe (shared with mSATA) slots provide the support of SSD and wireless interfaces which allow effortless connection to Wi-Fi and Bluetooth networks, and 4Gconnectivity. DIO / COM / LAN / PoE / Power Ignitoin expansion modules extend the capability and possibility to be used in more applications.

The MX1-D is also an NVIDIA GPUCloud (NGC) solution for customers to implement Artificial Intelligence applications. The MX1-D has undergone additional tests for security and remote system control, which are fundamental requirements for such deployments. MX1-D is an ideal system to run DGX ™, providing ease of deployment.

Characteristics

Xeon

  • Up to 1.36X Performance Improvement compared to the previous generation
  • Fanless design with up to Xeon TDP 80W
Xeon

Core i

  • Up to 1.15X Performance Improvement compared to 7th generation
Core-i

ECC DDR4 memory

ECC DDR4 memory

Versatile Expansion Modules

The versatile Xpansion Module design, offers various I / O functionalities through its lower clever cost effective modulation, providing all functions within one system.

  • Versatile I / O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO
  • Power ignition Xpansion module for vehicle application
Expansion Modules

Edge AI Accelerator

4X Intel® Movidius ™ Myriad ™ X for Edge AI

MX1-10FEP-D with AI modules powered by Intel® Movidius ™ Myriad ™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.

Edge AI Accelerator
Edge AI Accelerator

Supports High Resolution Triple Display

Supports triple independent displays (DP + HDMI + DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.

  • Display Port 1.2 (4K @ 60Hz)
  • HDMI 1.4 (4K @ 30Hz)
  • DVI-I (FHD @ 60Hz)
High Resolution Triple Display

-40 ~ 70º C Wide Temperature

MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from -40 oC to 70 oC.

Wide Temperature

Certificate

MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.

Certificate

MX1-10FEP I / O

MX1-10FEP_I / O

Dimensions

MX1-10FEP-dimension
Specifications

MX1-10FEP (MX1-10FEP)

Model chipset Thermal Power AC Adaptor
MX1-10FEP-C246 C246 Fanless 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity none
MX1-10FEP-C246-AC300 C246 Fanless 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity 300W AC to DC Adapter
MX1-10FEP-C246-AC220 C246 Fanless 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity 220W AC to DC Adapter
MX1-10FEP (MX1-10FEP) Specifications
SYSTEM CPU 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7 / i5 / i3 6-core TDP Max. 65W, Core i9 8 -core TDP Max 35W / * Please see the CPU Options in Docs / Manuals
CHIPSET Intel® C246
SYSTEM MEMORY Max. 32GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM
GRAPHICS Intel® HD Graphics
DISPLAY INTERFACE DisplayPort 1.2 / DVI-I / HDMI 1.4
STORAGE SLOT 3 x 2.5 HDD / SSD (1 w / Removable HDD Bay, 2 w / Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD
ETHERNET Intel® I219-LM Giga LAN + I210-IT Giga LAN
AUDIO Realtek® ALC662
I / O CHIPSET Nuvoton NCT6116D
TPM Nuvoton NPCT750AAAYX TPM2.0
EXPANSION SLOT Storage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage / LTE / Wireless: 2 x mPCIe Full / Half size (USB / PCIe / SATA), w / SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB)
INTERNAL SPEAKER 1 x Buzzer
INDICATOR DIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED
FRONT I / O 1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w / Cover / 1 x 2.5 "SATAIII HDD / SSD Bay
REAR I / O 1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5) Mic-in / 12 x Line-out / 1 x PS / 1 / 1 x PCIe x2 slot / 1 x 16-pin Terminal Block Remote Power Reset / 1 x 2-pin Terminal Block Power Input / 1 x 3-pin Terminal Block External Fan Connector / 1 x 4-pin Terminal Block Remote Power on / off / 1 x SMA Antenna (Optional for WiFi / LTE function)
EDGE AI ENGINE (Optional) 1X / 2X / 3X / 4X Movidius Myriad X VPU, and Intel® OpenVINO ™ toolkit supported (Optional)
POWER REQUIREMENT POWER INPUT 9 ~ 48V Wide Range DC Input w / Terminal Block Connectivity
POWER ADAPTER Optional:
ENVIRONMENTAL OPERATING TEMPERATURE 35W TDP Processor: -40 ° C to 70 ° C / 51 ~ 65W TDP Processor: -40 ° C to 50 ° C / 71W TDP Processor: -80 ° C to 40 ° C / with 40m / s Air Flow and Wide Temperature Memory / Storage
STORAGE TEMPERATURE -40 ~ 85 ° C (-40 ~ 185 ° F)
OPERATING HUMIDITY 10% ~ 90% R / H (Non-condensing)
STORAGE HUMIDITY 10% ~ 95% @ 85 ° C non-condensing
VIBRATION RESISTANCE Operating: 5Hz ~ 500Hz / 5Grms / 3Axis (w / SSD, according to IEC60068-2-64)
SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w / SSD, according to IEC60068-2-27)
QUALITY CERTIFICATION CE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155 / LVD CoC: EN62368-1
MECHANICAL THERMAL DESIGN Fanless
MOUNTING Wallmount
DIMENSIONS (WXDXH) 10.6 "x 9.7" x 4.3 "(268 x 246 x 108 mm)
WEIGHT 6.9kg (15.2 lb)
OS OS SUPPORT Windows® 10 64-bit / Linux (support by request)
PACKING LIST PACKAGE 1 x Driver CD / 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets (2PCS in 1 set) / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Y Cable (3rd SSD / HDD needs optional SATA Y cable)
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