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Fanless embedded system with Intel® Coffee Lake Xeon / Core-i processor
MiTAC's MX1-10FEP embedded system is the next generation embedded system with Intel® Coffee Lake C246 workstation chipset which can support Xeon and Core-i LGA1151 socket type processor. The excellent performance, powerful processor, OCP / OVP power protection, and expandable design provide the solution for every complicated task and most types of application.
The MX1-10FEP's 7.8 liter fan-less chassis design and Xpandable module design give it the possibility to implement the complicated tasks and for every workspace and environment. VESA mount holes allow for space-saving and rear-mounting on VESA arms. Flexibilities also mean a rich array of I / O ports (including 2 x RJ45 Ethernet, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, PCIe X16 slot, 3-pin Terminal Block Power Input, and 3 x Expansion doors) to add a variety of peripherals. Storage expandability is supported for 3 x high-density hard drives in 2.5 "HDD bracket design. Two mPCIe (shared with mSATA) slots provide the support of SSD and wireless interfaces which allow effortless connection to Wi-Fi and Bluetooth networks, and 4Gconnectivity. DIO / COM / LAN / PoE / Power Ignitoin expansion modules extend the capability and possibility to be used in more applications.
The MX1-D is also an NVIDIA GPUCloud (NGC) solution for customers to implement Artificial Intelligence applications. The MX1-D has undergone additional tests for security and remote system control, which are fundamental requirements for such deployments. MX1-D is an ideal system to run DGX ™, providing ease of deployment.
Xeon
- Up to 1.36X Performance Improvement compared to the previous generation
- Fanless design with up to Xeon TDP 80W

Core i
- Up to 1.15X Performance Improvement compared to 7th generation

ECC DDR4 memory

Versatile Expansion Modules
The versatile Xpansion Module design, offers various I / O functionalities through its lower clever cost effective modulation, providing all functions within one system.
- Versatile I / O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO
- Power ignition Xpansion module for vehicle application

Edge AI Accelerator
4X Intel® Movidius ™ Myriad ™ X for Edge AI
MX1-10FEP-D with AI modules powered by Intel® Movidius ™ Myriad ™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.


Supports High Resolution Triple Display
Supports triple independent displays (DP + HDMI + DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.
- Display Port 1.2 (4K @ 60Hz)
- HDMI 1.4 (4K @ 30Hz)
- DVI-I (FHD @ 60Hz)

-40 ~ 70º C Wide Temperature
MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from -40 oC to 70 oC.

Certificate
MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.

MX1-10FEP I / O

Dimensions

MX1-10FEP (MX1-10FEP) | ||||
Model | chipset | Thermal | Power | AC Adaptor |
---|---|---|---|---|
MX1-10FEP-C246 | C246 | Fanless | 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity | none |
MX1-10FEP-C246-AC300 | C246 | Fanless | 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity | 300W AC to DC Adapter |
MX1-10FEP-C246-AC220 | C246 | Fanless | 9 ~ 48V Wide Rage DC Input w / Terminal Block Connectivity | 220W AC to DC Adapter |
MX1-10FEP (MX1-10FEP) Specifications | |||
---|---|---|---|
SYSTEM | CPU | 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7 / i5 / i3 6-core TDP Max. 65W, Core i9 8 -core TDP Max 35W / * Please see the CPU Options in Docs / Manuals | |
CHIPSET | Intel® C246 | ||
SYSTEM MEMORY | Max. 32GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM | ||
GRAPHICS | Intel® HD Graphics | ||
DISPLAY INTERFACE | DisplayPort 1.2 / DVI-I / HDMI 1.4 | ||
STORAGE SLOT | 3 x 2.5 HDD / SSD (1 w / Removable HDD Bay, 2 w / Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD | ||
ETHERNET | Intel® I219-LM Giga LAN + I210-IT Giga LAN | ||
AUDIO | Realtek® ALC662 | ||
I / O CHIPSET | Nuvoton NCT6116D | ||
TPM | Nuvoton NPCT750AAAYX TPM2.0 | ||
EXPANSION SLOT | Storage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage / LTE / Wireless: 2 x mPCIe Full / Half size (USB / PCIe / SATA), w / SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB) | ||
INTERNAL SPEAKER | 1 x Buzzer | ||
INDICATOR | DIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED | ||
FRONT I / O | 1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w / Cover / 1 x 2.5 "SATAIII HDD / SSD Bay | ||
REAR I / O | 1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5) Mic-in / 12 x Line-out / 1 x PS / 1 / 1 x PCIe x2 slot / 1 x 16-pin Terminal Block Remote Power Reset / 1 x 2-pin Terminal Block Power Input / 1 x 3-pin Terminal Block External Fan Connector / 1 x 4-pin Terminal Block Remote Power on / off / 1 x SMA Antenna (Optional for WiFi / LTE function) | ||
EDGE AI ENGINE (Optional) | 1X / 2X / 3X / 4X Movidius Myriad X VPU, and Intel® OpenVINO ™ toolkit supported (Optional) | ||
POWER REQUIREMENT | POWER INPUT | 9 ~ 48V Wide Range DC Input w / Terminal Block Connectivity | |
POWER ADAPTER | Optional: | ||
ENVIRONMENTAL | OPERATING TEMPERATURE | 35W TDP Processor: -40 ° C to 70 ° C / 51 ~ 65W TDP Processor: -40 ° C to 50 ° C / 71W TDP Processor: -80 ° C to 40 ° C / with 40m / s Air Flow and Wide Temperature Memory / Storage | |
STORAGE TEMPERATURE | -40 ~ 85 ° C (-40 ~ 185 ° F) | ||
OPERATING HUMIDITY | 10% ~ 90% R / H (Non-condensing) | ||
STORAGE HUMIDITY | 10% ~ 95% @ 85 ° C non-condensing | ||
VIBRATION RESISTANCE | Operating: 5Hz ~ 500Hz / 5Grms / 3Axis (w / SSD, according to IEC60068-2-64) | ||
SHOCK RESISTANCE | Operating: 50 Grms, Half-sine 11 ms Duration (w / SSD, according to IEC60068-2-27) | ||
QUALITY CERTIFICATION | CE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155 / LVD CoC: EN62368-1 | ||
MECHANICAL | THERMAL DESIGN | Fanless | |
MOUNTING | Wallmount | ||
DIMENSIONS (WXDXH) | 10.6 "x 9.7" x 4.3 "(268 x 246 x 108 mm) | ||
WEIGHT | 6.9kg (15.2 lb) | ||
OS | OS SUPPORT | Windows® 10 64-bit / Linux (support by request) | |
PACKING LIST | PACKAGE | 1 x Driver CD / 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets (2PCS in 1 set) / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Y Cable (3rd SSD / HDD needs optional SATA Y cable) |
Normal Delivery | 3 to 5 working days
Urgent Delivery | 1-2 business days
* unless out of stock